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Meeting Materials Science & Technology 2019
Symposium Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Presentation Title Micro Interconnect Mechanical Stability in Cryogenic Temperature Environment
Author(s) Ande Kitamura, Timothy Mathews, David Routledge , Tae-Kyu Lee
On-Site Speaker (Planned) Ande Kitamura
Abstract Scope Recent application in quantum computing and extreme environment end-use conditions pushed the temperature limit for an electric component to an unprecedented low temperature. Although the performance of those components are those temperature range are extensively studied, the interconnections which are still mainly Sn based needs a thorough observation and assessment to support the mechanical and electrical stability at those low environments. Sn based solder interconnects are subjected to be shear tested at various temperature between 150oC and -196oC. The isothermal aging impact and the testing temperature reveals a variation of mechanical response which will be discussed.
Proceedings Inclusion? Definite: At-meeting proceedings


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