ProgramMaster Logo
Conference Tools for Materials Science & Technology 2019
Login
Register as a New User
Help
Submit An Abstract
Propose A Symposium
Presenter/Author Tools
Organizer/Editor Tools
About this Abstract
Meeting Materials Science & Technology 2019
Symposium Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Presentation Title Micro Interconnect Mechanical Stability in Cryogenic Temperature Environment
Author(s) Ande Kitamura, Timothy Mathews, David Routledge , Tae-Kyu Lee
On-Site Speaker (Planned) Ande Kitamura
Abstract Scope Recent application in quantum computing and extreme environment end-use conditions pushed the temperature limit for an electric component to an unprecedented low temperature. Although the performance of those components are those temperature range are extensively studied, the interconnections which are still mainly Sn based needs a thorough observation and assessment to support the mechanical and electrical stability at those low environments. Sn based solder interconnects are subjected to be shear tested at various temperature between 150oC and -196oC. The isothermal aging impact and the testing temperature reveals a variation of mechanical response which will be discussed.
Proceedings Inclusion? Definite: At-meeting proceedings

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A Model Study of Microstructure Evolution and Bi Diffusion in Sn-Bi Low Temperature Soldering Systems
Corrosion Behavior of Electroplated and Electroless Plating Ni/Pd/Au Surface Finish on Automobile Printed Circuit Board
Effect of Reducing Agent on the Joint Strength of Sintered-joint with Cu Paste
Effect of Thermal Annealing on Structural Integrity of Cu-filled-through Si Via (TSV)
Heated Mechanical Cycling as a Substitute for Thermal Cycling - A Preliminary Investigation for a New Failure Analysis Technique
IMC Evolution as a Function of Grain Orientation under High Current Density in Sn-based Solder Joints
Instability Detection in Press-fit Connector Pin Interconnects after Thermo-mechanical Cycling
Interfacial Reactions in Co/Ag-Cu, Ni/Ag-Cu, Co/Ag-Sb and Ni/Ag-Sb Couples
Micro Interconnect Mechanical Stability in Cryogenic Temperature Environment
Micro Interconnect Shear and Creep Performance under Current Stressing
Microstructure Evolution in Cu and Ag Coated Cu Particle Sintering for Power Module Interconnection
Predicting Electromigration-mediated Damage in Interconnects Using Phase-Field Models
Stretchable Joint with Ag-PDMS for Wearable Electronics
Understanding Reliability Failure Mechanisms in Pb Free Solder Joint with Micro-gap Configuration

Questions about ProgramMaster? Contact programming@programmaster.org