|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||The High Temperature Performance of BiAgX® As a Lead-Free Drop-In Solder
||HongWen Zhang, Ning-Cheng Lee
|On-Site Speaker (Planned)
The BiAgX® pastes, designed as a drop-in lead-free solution for high temperature bonding, have been tested and validated for the applications operated equal to or below 200oC. The reliability of BiAgX is comparable to or even better than the high lead solder although Bi was considered brittle. The fatigue streaks have been identified within Bi grains after the thermal cycling test, which is similar to high lead solder. A brittle-to-ductile transition at the elevated temperature between 100 to 150oC has been observed in BiAgX joint and is attributed to the formation of fatigue streaks.
||Planned: A print-only volume