|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Development of Interconnection Technology for Double Side Power IC Module
||Zixuan Zhu, C.C. Li, L. L. Liao, M. J. Dai, C. K. Liu, C. Robert Kao
|On-Site Speaker (Planned)
The Au-20Sn solid-liquid interdiffusion (SLID) bonding technique is used to assemble the IGBT Power IC electronic component and Direct Bond Copper (DBC) substrate in order to improve production yield and lower production cost. The bonded sample had sandwich structure: Ni/Au-20Sn/Ni. The growth kinetic of intermetallic compounds and microstructure evolution of intermetallic compounds during isothermal aging at 150℃ 200℃ 240℃, were examined by SEM and EPMA. Thereafter the mechanical properties of intermetallic compounds in this system were investigated by nanoindentation. These interfacial reactions could provide good mechanical strength for interconnection. In addition, the success of this bonding development provides a good thermal stability for IGBT power IC module which require long-term operations during high temperature.
||Planned: A print-only volume