|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XV
||Low Temperature Au to Au Direct Bonding by Highly <110>-oriented Au Films
||Jia-Ming Li, Chih Chen
|On-Site Speaker (Planned)
Previous studies have shown that Cu-Cu direct bonding with highly <111>-orientated Cu film can be achieved at lower temperatures and with regular vacuum conditions. However, Cu can be oxidized at high temperatures. In this study, we present another direct bonding approach with gold films, which has been used to passivate Cu or Ni films. Gold films with <110>-preferred orientation prepared by DC electroplating possess the structure of fine grains and with nanotwins. Two Au films with <110> preferred orientation were then bonded together directly under 0.76 MPa compressive stress in 10-3 torr vacuum condition at 200 and 250 oC for 1 hour and 20 min, respectively. Excellent bonding interfaces can be obtained after the bonding conditions. Extensive grain growth was observed after the annealing.
||Planned: A print-only volume