|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Solder Wetting Behavior of Plasma Organic Surface Finish with Multiple Heat-Treatment
||Kyoung-Ho Kim, Sehoon Yoo, Junichi Koike
|On-Site Speaker (Planned)
Plasma surface finish is organic thin films deposited by PECVD. Unlike electroplated surface finish, plasma finish is an environmental-friendly finish because the plasma finish doesn’t produce waste solution. Beside the green property, the plasma surface finish has advantages such as long-term shelf life and high corrosion-resistance. In this study, the solder wetting behaviors of the plasma finished on Cu pads were evaluated with varying the number of heat-treatment to understand oxidation-resistance of the plasma finish. For the multiple heat-treatment, the plasma surface finished PCB was heated in reflow oven up to 5-times with peak temperature of 251℃. Wetting force of as-received plasma finished sample was 1.93mN, while OSP was 1.3mN. The solder spreading area of the plasma surface finish sample was not changed with the multiple heat-treatment while OSP sample decreased approximately 14% after 5-times of heat-treatment. The surface microstructure and chemistry was also observed with SEM, XPS and FTIR.
||Planned: A print-only volume