The residual stress present in manufactured components can have a severe impact on fatigue life, distortion, stress corrosion cracking, crack initiation and propagation. Residual stress is introduced in nearly every step during the manufacturing process and characterization of this stress is vital. Understanding the total stress present in the component during its life cycle is essential to evaluating the viability of the manufactured part. In particular, failure critical locations often have known levels of residual stress that must be adhered to, and therefore must be characterized for quality compliance. X-ray diffraction (XRD) is commonly used to measure residual stress, as it is both quantitative and nondestructive. Recent advances have allowed XRD to become an extremely flexible and accurate method of stress characterization, allowing access to measurement locations in complex part geometries as well as access to field measurements with short measurement times and accurate results.