|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Impact of Interrupted Thermal Cycling on Sn-Ag-Cu Interconnection Performance
||Tae-Kyu Lee, Zhiqiang Chen, Greg Baty, Thomas R. Bieler, Choong-Un Kim
|On-Site Speaker (Planned)
The expected life cycle time for solder interconnects in electronic devices can be evaluated by accelerated thermal cycling test. The characteristic life cycle number or 1% failure rate are used to estimate the expected life cycle time based on the device end-use conditions. But given the fact that the device in real function experience interrupted thermal cycling in service, the impact of the discontinued thermal cycling was investigated. Fine pitch ball grid array (BGA) components with Sn-Ag-Cu interconnects were thermal cycled with interruption cycles in various storage time intervals. The components assembled on 2.4mm thick PCB, were stored at a constant temperature of 50oC in air and in vacuum to observe the environmental affects during thermal cycling interruption. The results show that the life cycle number varies with interval time and storage environment. A potential mechanism of the degradation and improvement of thermal cycling performance will be discussed.
||Planned: Supplemental Proceedings volume