|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||L-62: Investigation of Melting Behavior and Morphology Change of Sn Nanowires based on Infra-red (IR) Heating Method
||Jirui Wang, Fan Gao, Zhiyong Gu
|On-Site Speaker (Planned)
Infra-red (IR) based soldering method is a non-contact soldering method with focused heating area and short heating duration. The whole soldering process can be done within a few seconds without spreading too much unnecessary heat to the surrounding in order to protect thermal sensitive components or substrates such as polymers or organic molecules. In this study, Sn nanowires were prepared by the electrodeposition method using nanoporous templates and used as a model system to investigate the melting behavior and morphology evolvement of nanowires upon IR heating. Several important factors, including the choice of flux, operating temperature, and heating time, were studied for their effect on solder nanowire melting. The melting behavior and morphology change were examined by field emission scanning electron microscopy (FE-SEM). The process parameters were optimized to obtain uniform and fully reflowed solder balls, which is important for IR-based soldering of nanowire devices.
||Planned: Supplemental Proceedings volume