|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Sn Whisker Growth in Air HAST
||Chulmin Oh, Wonsik Hong
|On-Site Speaker (Planned)
Sn whisker hasn’t been solved in the electronics industry yet although many researcher have studied the growth mechanism of Sn whisker. The test of Sn whisker has been still proceeded with the JEDEC standard to confirm the mitigation performance of Sn whisker. However, in the high temperature/humidity storage test described in JEDEC standard, the test time (4,000h) is too long to correlate with the development timeline. We here investigate the test method of Air HAST where the partial air is able to insert in the HAST chamber, enable to accelerate the oxidation process at HAST condition. The specimens consisting of QFP, SOP, and MLCC are soldered on FR-4 board with various Br content of Pb-free solder materials. Sn whisker observed by optical microscope and SEM by changing the air pressure and compared the Sn whisker in the high temperature/humidity storage to identify the same growth mechanism of Sn whisker.
||Planned: Supplemental Proceedings volume