|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Powder Metallurgy of Light, Reactive and Other Non-ferrous Metals
||Effect of Minor Titanium Addition on Copper/Diamond Composites Prepared by Hot Forging
||Fei Yang, Wei Sun, Ajit Singh, Leandro Bolzoni
|On-Site Speaker (Planned)
Copper/diamond composites have great potential to lead the next generation of advanced heat sink materials for using in high-power electronic devices and high density integrated circuits, due to its potential excellent properties of high thermal conductivity and close thermal expansion to the chip materials (e.g. Si, InP, GaAs). However, the poor wettability between copper and diamond is a challenge of synthesising copper/diamond composites with good metallurgical bonding, causing poor thermal performance. In this paper, copper/diamond composites were successfully prepared by hot forging of elemental copper and artificial diamond powders, and small amount (0 vol%, 3 vol% and 5 vol%) of titanium additives. Microstructure observation and mechanical tests showed that the bonding between copper and diamond was significantly improved with adding minor titanium, leading to less cracks were observed. The strongest bonding strength was achieved when the amount of titanium added was 3 vol%. The possible reasons were discussed as well.
||Planned: Supplemental Proceedings volume