| About this Abstract |
| Meeting |
MS&T22: Materials Science & Technology
|
| Symposium
|
Advances in Dielectric Materials and Electronic Devices
|
| Presentation Title |
Designing Novel Dielectric Composites with High Thermal Conductivity Enabled by Cold Sintering |
| Author(s) |
Javier Mena-Garcia, Arnaud Ndayishimiye, Zhongming Fan, Devon Eichfeld, Christopher Wheatley, Haley Jones, Andrea Arguelles, Brian Foley, Clive Randall |
| On-Site Speaker (Planned) |
Javier Mena-Garcia |
| Abstract Scope |
Cold Sintering Process (CSP) offers unique opportunities to design novel electroceramic composites with materials that are typically difficult or impossible to co-process. It incorporates fillers at the boundaries and among the grains of a polycrystalline ceramic matrix, while preserving their chemical composition by being sintered at extremely low temperatures (≤300°C). The engineered microstructure enabled by CSP permits to consider new local interfacial functionality of the grain boundaries for thermal and electrical transport. In this research project, we aim to design new composites with low dielectric loss and high thermal conductivity while still limiting the electrical conductivity, for microwave applications of high power and high frequency, via CSP. Our research addresses to fulfill the demands of more bandwidth in 5G and 6G communication technology, finer resolution in vehicle radar systems and autonomous driving. Our goal is to achieve a 10X improvement over commercial state of the art low temperature cofired materials. |