|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVII
||Electrochemical Etching of Solder Resist to Improve Adhesion of Electroless Copper Plating in PCB
||Jong-Chan Choi, Jaeho Lee
|On-Site Speaker (Planned)
Fan out wafer level package (FOWLP) has been a trend in packaging industry and panel level package (PLP) is new technology in PCB package. In PLP, the copper line is formed on solder resist (SR). The adhesion of electroless copper on SR is not strong enough to meet the industrial standard and then etching of SR is one of the required process. In this study, the effect of etchant on the adhesion of electroless copper is investigated. Manganese base etchants are used for this purpose. Manganese etchant is fabricated by electrolysis method. OCV and CV are used to analyze the property of etchant. Acidic and basic etchants are used and compared. Combination of acidic and basic etchant can improve the roughness of SR and consequently the adhesion of electroless copper is improved.
||Planned: Supplemental Proceedings volume