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Meeting 2018 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVII
Presentation Title Electrochemical Etching of Solder Resist to Improve Adhesion of Electroless Copper Plating in PCB
Author(s) Jong-Chan Choi, Jae-Ho Lee
On-Site Speaker (Planned) Jae-Ho Lee
Abstract Scope Fan out wafer level package (FOWLP) has been a trend in packaging industry and panel level package (PLP) is new technology in PCB package. In PLP, the copper line is formed on solder resist (SR). The adhesion of electroless copper on SR is not strong enough to meet the industrial standard and then etching of SR is one of the required process. In this study, the effect of etchant on the adhesion of electroless copper is investigated. Manganese base etchants are used for this purpose. Manganese etchant is fabricated by electrolysis method. OCV and CV are used to analyze the property of etchant. Acidic and basic etchants are used and compared. Combination of acidic and basic etchant can improve the roughness of SR and consequently the adhesion of electroless copper is improved.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A Phase-field Model on Electromigration-induced Transgranular Void Migration in Interconnects
Alloy Phase Stability under Electric Currents
Dissolution Kinetic of Ni Wire in Sn and Sn3.5Ag Solder
Effect of Ag Additives on Dissolution Kinetic of Cu Wire in Sn and Sn3.5Ag Solder
Effects of Electrochemical Parameters on the Physical Properties of Ni-Co Electroplating
Electric Current-induced Slip/Twin Transition: An In Situ EBSD Study
Electrochemical Etching of Solder Resist to Improve Adhesion of Electroless Copper Plating in PCB
Fabrication and Characterization of (111)-oriented and Nanotwinned Cu by Periodic Reverse Electrodeposition
Ga-doping Effect upon Sn-0.7Cu/Cu Interfacial Reactions and the Isothermal Section of Sn-Cu-Ga Ternary System
High-entropy Oxides Li(Ni0.2Mn0.2Co0.2Zn0.2Cu0.2)O2 as Cathode Materials for Lithium-ion Batteries
Inter-diffusion at Ag/Cu Interface
Interfacial Reaction Studies in SLID Bonding Processes Using Ga and In
Interfacial Reactions in the Au/Sn/Ni/Cu Multilayer Couples
Hide details for [<a href="/PM/PM.nsf/ApprovedAbstracts/7B7A9BA8C19DD3BE85258150001FB51F?OpenDocument">K-13: Interfacial ReactiK-13: Interfacial Reactions between Lead-free Solders and Cu-xZn Alloys
[Replication or Save Conflict]
K-14: Microstructure and Optical Properties of Cr1-xAlxN Films Synthesized by Reactive Magnetron Sputtering
K-15: The Electromigration Effect Revisited: An In Situ SEM and SR-based XRD Study
Liquidus Projection of Quaternary Ge-Sn-Co-Sb System and Thermoelectric Properties of Sn/Ge Doped Skutterudite CoSb3
Mechanical Properties of In-33.7Bi Alloy for Low Melting Temperature Solder
Microstructure Evolution due to Isothermal Reactive Diffusion between Solid Co and Liquid Sn
Microstructure Evolution of Al Wire Bonded on Cu Metallization under Electromigration Test
Minor P-doping in the Electroplated Co(P) Layer to Strongly Suppress IMC Formation in Lead-free Solder Joints
Nanoparticles and Nanowires Based on Ag and Cu in Printed Electronics and Transparent Electrode
On the Existence of a Two-phase Field in Binary α-Cu(Al) Solid Solutions
Phase Equilibria and Thermodynamic Assessment of the Mo-Nb-Re Ternary System
Phase Equilibria of the Li-Si-C System for Advanced Anodes in Li-ion Batteries
Predication of the Intrinsic Properties of Multi-component Electrodes for Li-ion Batteries from Aspect of Thermodynamics
Sinter Joining and Wiring without Pressure Assist for GaN Power Device Interconnection
Solid-solution Cu-to-Cu Interconnection Fabricated with Sub-micron Ga-based Pastes
Structural Stability and Chemical Reactivity of Nanoscale Twinning Structure in Copper Nanowires
The Investigation of Electromigration Defects on Cu/Sn and Cu/Ag IMC due to Currents Stress and Temperature
The Role of Retained Structures in Phase Transition and Piezoelectric Properties of PMN-PT Single Crystals
The Study of Interfacial Reactions between Sn and C194 Alloy
Thermodynamic Stability Maps for the La0.6Sr0.4Co0.2Fe0.8O3▒δ–SO2–O2áSystem for Application in Solid Oxide Fuel Cells

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