|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Intermetallic Growth in Sn-10Cu Hyperperitectic Lead-free Solder Paste
||R.M. Said, M.A.A. Mohd Salleh, M.I.I. Ramli, M.N. Derman, N. Saud, K. Nogita
|On-Site Speaker (Planned)
This study investigates the behavior of eutectic Sn-0.7Cu (SC) and hyperperitectic Sn-10Cu (SC10) solder paste during soldering and subjected to isothermal aging. Cu6Sn5 and Cu3Sn primary and interfacial intermetallic compound (IMC) growth were studied during soldering. The evolution of microstructure characteristics and IMC growth kinetic of the solder joint after aging also analyzed. Results showed that the interfacial IMC of as-reflowed SC10 solder was scallop. Upon increasing aging time, the scallop type of IMC changed to a more planar type morphology for both solder joints. Microstructure of SC10 solder consists of long strip of Cu6Sn5 phase and some peritectic Cu6Sn5 phase grows surrounding the primary Cu3Sn. These IMCs tends to grew larger and coarsen under aging condition. The interfacial IMCs thickness and growth rate for SC10 solder joint was obtained. Results obtained in this study could be used as a basis in developing Sn-Cu high temperature solder joints applications.
||Planned: Supplemental Proceedings volume