|About this Abstract
||Materials Science & Technology 2019
||Processing and Performance of Materials Using Microwaves, Electric and Magnetic Fields, Ultrasound, Lasers, and Mechanical Work – Rustum Roy Symposium
||Thermal Analysis of a High Temperature Coaxial Dielectric Test Cell
||Robert Tempke, Candice Ellison, Christina Wildfire, Terence Musho, Dushyant Shekhawat
|On-Site Speaker (Planned)
This study analyzes a simple high temperature test cell for testing coaxial dielectric properties. There are several methods available in literature that aim to accomplish this but require expensive and time-consuming setups. The test cell is designed using commercially available parts to reduce cost and complexity. The difficulty in high temperature testing is connector and coaxial line thermal expansion, this study focuses on controlling temperature at the connectors using water-cooled heat sink. Reducing expansion and allowing for high precision testing. FEA software is used to analyze the proposed test cell over a period of 5 hours. The temperature is ramped up from room temperature of 23 °C to 500 °C holding at 100° increments for one hour each to study sintering and temperature effects on dielectric properties. The connectors temperature as a function of temperature are analyzed to show that it’s within an acceptable bound and validated using experimental results.
||Planned: At-meeting proceedings