|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Long Term Isothermal Aging Effect on Reliability of Doped Lead-Free Solder Joint
||Cong Zhao, John Evans, Jeffrey Suhling, Michael Bozack
|On-Site Speaker (Planned)
This study is to evaluate effect of long-term isothermal aging and thermal cycling on reliability of doped lead-free solder mixes. Twelve doped solder pastes supplied by eight companies, as well as SAC105 and SAC305 solder balls together with three board platings of OSP, ImAg and ENIG are being tested. Package sizes ranges from 15mm, 0.8mm pitch to 6mm, 0.5mm pitch BGA, and QFN and 2512 Resistor were tested. Aging condition is 125℃ with 12 months. Subsequently, specimens were thermally cycled from -40℃ to 125℃ with 15 minutes dwell time. Failure modes of solder joints will be investigated using SEM. IMC layers thickness will be measured. EDX will be employed to analyze the chemical characterization of IMC layer for SAC/ImAg, SAC/OPS and SAC/ENIG systems. Data analysis will be performed to show the characteristic life degradation for different solder pastes under different conditions.
||Planned: Supplemental Proceedings volume