Abstract Scope |
Metallic glass (MG) coatings have been shown to have many unique properties, such as high strength and low friction. The low friction characteristics of MG coatings make them potentially useful for many applications, including needles. Previously, we demonstrated MG coatings can reduce insertion/retraction resistance when the needle is punctured into a rubber. In this presentation, we extended our application to the diamond blade for dicing hard and brittle materials commonly used in semiconductors and optoelectronics. The low friction of MG-coated dicing blades was shown to effectively reduce the number and size of chips, regardless of the target substrate. Overall, SiC and sapphire were most affected by chipping, due to the fact that higher cutting forces were needed for the higher hardness of SiC and sapphire. Compared to the uncoated blade, the MG coating provided the following reductions in chipping area: Si (~23%), SiC (~36%), and sapphire (~45%). |