About this Abstract |
Meeting |
2021 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2021)
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Symposium
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Materials
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Presentation Title |
New Gold Conductive Ink Formulation with Enhanced Cohesion for Material Jetting |
Author(s) |
Jisun Im, Feiran Wang, Gustavo Ferraz Trindade, Christopher Tuck |
On-Site Speaker (Planned) |
Jisun Im |
Abstract Scope |
Gold nanoparticles are one of the promising conductive materials for printed electronics since they have high electrical conductivity, good chemical resistance and biocompatibility compared to other metals. They therefore form an interesting material for multifunctional Additive Manufacturing. The drawbacks of inks containing nanoparticles include the short shelf-life due to agglomeration and the formation of microcracks or voids during post-processing, leading to reduced electrical conductivity and mechanical properties. In order to overcome those problems, we employed the ligand-stabilized gold nanoparticles with an average diameter of 2.3nm for better ink stability and lower sintering temperature for various substrates. In addition, we employed two different thiol-terminated types of cohesion enhancers in order to have a continuous and uniform printed pattern for high electrical conductivity in 2D and 3D. The gold ink can be sintered at as low as 120oC and the electrical conductivity of 2x106 S/m can be achieved after printing 5 layers. |
Proceedings Inclusion? |
Definite: Post-meeting proceedings |