|About this Abstract
||Materials Science & Technology 2019
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Micro Interconnect Shear and Creep Performance under Current Stressing
||Mohamed Sheikh, Scott Fuller, Yeonjin Baek, Tae-Kyu Lee
|On-Site Speaker (Planned)
The mechanical stability of ball grid array solder joints are crucial for the component reliability and performance. The solder ball not only provide the structural stability of the component, but also are the interconnections for signal and power. Given the condition that these interconnects are in constant current stressing, the mechanical stability and properties during current stressing is crucial to understand their long-term stability. In-situ current stressing and shear test are applied to 600micrometer Sn-Ag-Cu solder balls with a maximum current of 2A. The shear test and creep test are performed in various current stressing and isothermal aging conditions. The shifting of the deformation response and strength value along with the microstructure evolution will be discussed.
||Definite: At-meeting proceedings