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Meeting Materials Science & Technology 2019
Symposium Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Presentation Title Micro Interconnect Shear and Creep Performance under Current Stressing
Author(s) Mohamed Sheikh, Scott Fuller, Yeonjin Baek, Tae-Kyu Lee
On-Site Speaker (Planned) Mohamed Sheikh
Abstract Scope The mechanical stability of ball grid array solder joints are crucial for the component reliability and performance. The solder ball not only provide the structural stability of the component, but also are the interconnections for signal and power. Given the condition that these interconnects are in constant current stressing, the mechanical stability and properties during current stressing is crucial to understand their long-term stability. In-situ current stressing and shear test are applied to 600micrometer Sn-Ag-Cu solder balls with a maximum current of 2A. The shear test and creep test are performed in various current stressing and isothermal aging conditions. The shifting of the deformation response and strength value along with the microstructure evolution will be discussed.
Proceedings Inclusion? Definite: At-meeting proceedings

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A Model Study of Microstructure Evolution and Bi Diffusion in Sn-Bi Low Temperature Soldering Systems
Corrosion Behavior of Electroplated and Electroless Plating Ni/Pd/Au Surface Finish on Automobile Printed Circuit Board
Effect of Reducing Agent on the Joint Strength of Sintered-joint with Cu Paste
Effect of Thermal Annealing on Structural Integrity of Cu-filled-through Si Via (TSV)
Heated Mechanical Cycling as a Substitute for Thermal Cycling - A Preliminary Investigation for a New Failure Analysis Technique
IMC Evolution as a Function of Grain Orientation under High Current Density in Sn-based Solder Joints
Instability Detection in Press-fit Connector Pin Interconnects after Thermo-mechanical Cycling
Interfacial Reactions in Co/Ag-Cu, Ni/Ag-Cu, Co/Ag-Sb and Ni/Ag-Sb Couples
Micro Interconnect Mechanical Stability in Cryogenic Temperature Environment
Micro Interconnect Shear and Creep Performance under Current Stressing
Microstructure Evolution in Cu and Ag Coated Cu Particle Sintering for Power Module Interconnection
Predicting Electromigration-mediated Damage in Interconnects Using Phase-Field Models
Stretchable Joint with Ag-PDMS for Wearable Electronics
Understanding Reliability Failure Mechanisms in Pb Free Solder Joint with Micro-gap Configuration

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