|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVI
||High Temperature Phase Stability of α2-Cu3Al in Binary Cu-Al Alloys: Issues in the Al-Cu Phase Diagram
||Valery Ouvarov-Bancalero, Choong-Un Kim
|On-Site Speaker (Planned)
This research reports experimental observations concluding that the thermal stability of the α<SUB>2</SUB>-Cu<SUB>3</SUB>Al intermetallic compound in the Cu-Al binary system goes way beyond its peritectoid decomposition at 363°C, suggesting that the currently accepted Cu-Al phase diagram may contain errors in representing phase equilibria at the Cu-rich end. This conclusion is evidenced by an interdiffusion study conducted with diffusion couples of thick Cu plates coated with 2μm thick Al thin films. X-ray diffraction coupled with Rietveld refinement, and electron microscope characterizations carried out after annealing between 450 and 750°C, yield irrevocable evidence supporting the existence of α<SUB>2</SUB>-Cu<SUB>3</SUB>Al at high temperatures. It is further found that α<SUB>2</SUB>-Cu<SUB>3</SUB>Al coexist with the equilibrium phase β above 650°C on the Cu side of the diffusion couple. These results along with discussions as to their implications to the phase equilibria in Al-Cu binary system and reinterpretation of results in similar investigation to ours will be presented.
||Planned: Supplemental Proceedings volume