In a recent review—“Fracture strength of micro- and nano-scale silicon components,” F.W. DelRio, R.F. Cook, B.L. Boyce, Appl. Phys. Rev. 2, 021303-1-51 (2015)—the fracture strengths of single crystal silicon (SCS) and polysilicon micro- and nano-scale components in the context of microelectromechanical systems (MEMS) were considered. This presentation provides some highlights from the review, addressing such questions as: How well do experimental measurements of elastic and fracture resistance properties of SCS and polysilicon MEMS-scale components agree with theoretical predictions? How do such measurements relate to toughness in an anisotropic material such as SCS? How do fracture strengths vary as a function of processing conditions, component size and geometry, and test temperature, environment, and loading rate? What do fracture mechanics analyses allow us to infer about the nature of the strength-controlling flaws in MEMS components? The overall findings are analyzed to form overarching processing-structure-property-performance relationships, including reliability predictions.