|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Effects of Composition and Assembly Processes on the Microstructure and Reliability of Various Lead Free Solder Alloys
||Babak Arfaei, Francis Mutuku, Eric Cotts
|On-Site Speaker (Planned)
The effect of processing on the microstructure and reliability of SnAgCu solder joints was examined. The thermal history, substrate metallization and solder composition were varied (including the addition of Bi, Ni, or Sb elements to the solder). Variations in thermal history were controlled and monitored for each individual solder joint with a differential scanning calorimeter. Results from room temperature shear fatigue tests were compared to those from accelerated thermal cycling tests. Careful microstructural analysis was performed on different samples as function of parameter values (including changes in temperature and load during test), and as a function of number of cycles in test (percentage of characteristic lifetime). Solder composition was found to dominate reliability results, while effects of thermal history also contributed to variations in performance. These differences in reliability were correlated with changes in Sn grain morphology, precipitate sizes and morphologies in these Pb free solder joints.
||Planned: A print-only volume