Electromigration remains as one of the major reliability concerns in semiconductor industry since it was first recognized more than half century ago. Significant resource and efforts have been devoted to the understanding and mitigation of electromigration and its adverse effect on the reliability of integrated circuit (IC) technologies. Such activities include fundamental material change in interconnects, modification of metallization stack and metallurgy, novel wiring structures to benefit from Blech effect, as well as implementing restrictions in circuit designs. In this talk, a brief overview will be given to illustrate the progress in improving electromigration reliability in the IC industry, including the evolution in interconnect materials and structures, as well as the implication of electromigration on device operation and design. Also, some examples of recent applications and ideas, taking advantage of electromigration as a controlled process to enable functional devices, will be introduced.