ProgramMaster Logo
Conference Tools for 2018 TMS Annual Meeting & Exhibition
Login
Register as a New User
Help
Submit An Abstract
Propose A Symposium
Presenter/Author Tools
Organizer/Editor Tools
About this Abstract
Meeting 2018 TMS Annual Meeting & Exhibition
Symposium Recent Advances in Functional Materials for Printed, Flexible and Wearable Electronics
Presentation Title 3D Electronics and Sensor Circuits by Combining Conventional PCB Technology with Low Temperature Embedding and Forming
Author(s) Bart Plovie, Frederick Bossuyt, Jan Vanfleteren
On-Site Speaker (Planned) Jan Vanfleteren
Abstract Scope In this contribution we present a technology for the fabrication of arbitrarily shaped 3D circuits. In a first phase a stretchable electronics circuit is produced on a flat temporary carrier. In a standard approach the technology is based on flexible PCB technology, where Cu conductors are designed as meanders to make them extensible, and where components are solder assembled. The circuit however can also be a thin-film or printed electronics circuit. In a second phase the circuit is embedded in a polymer. Embedding technologies used so far are lamination and injection molding, but also 3D printing can easily be used. If thermoplastic or non-cured thermoset materials are used for embedding, the whole structure can subsequently be heated to temperatures close to the Tg of the used polymers and the whole structure, including the embedded electronics, can be deformed, resulting in a 3D structure with arbitrary shape.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

3-D Printed Polymer-based Gas Sensors
3D Electronics and Sensor Circuits by Combining Conventional PCB Technology with Low Temperature Embedding and Forming
3D Printed Anodes for Al-air Batteries
3D Printing of Metals and Metal Oxides from Solution for Energy and Biomedical Applications
3D Printing of Soft Ionic Actuators/Sensors for Soft Robotic Applications
Additive Manufacturing with Aerosol Jet: From Prototyping to Production
Challenges in Gravure and Direct-write Printing of Nano-colloidal Inks
Delaminated Inkjet Printed Lines with Improved Electro-mechanical Behavior
High Performance Sensors and Antennas by 2D and 3D Printing of Nanoparticles
Highly Stretchable Metallic Interconnects on Polymer Substrates: Architecture and Mechanisms
Hide details for [<a href="/PM/PM.nsf/ApprovedAbstracts/C0529C03377A93C285258193005AA23F?OpenDocument">Integrated and Flexible Integrated and Flexible Biosensors for Point-of-care Diagnostics
[Replication or Save Conflict]
Materials Integration for Flexible Electronics: Cu-interconnects, Supercapacitors
Microheater Array Powder Sintering: A New Process for Printed Electronics
Nondestructive Examination Study in P(VDF-TrFE) Filter System and PM2.5 Spatial Resolution Technology by Using Synchrotron Transmission X-ray Microscopy
Printable Functional Materials for Smart Fabrics
Recent Advancement on Printed, Stretchable, and Wearable Electronics in 2D Materials
Room-temperature Aerosol Deposition of PLZT Films on Polymer Substrates
Single-crystalline-like Semiconductor Films on Flexible Substrates: A Route towards Roll-to-roll Manufacturing of High-performance Electronic Devices
Stretchable Wirings Prepared with PU and Silver Flakes
Structural-resolved Study Of Piezoelectric Properties Of P(VDF-TrFE) Films
Textile-enabled Wearable Energy Storage Devices (invited)
Transparent Field Effect Biosensors Printed on Highly Curved Surfaces
Ultrafast Pulsed Light Sintering of Thermoelectric Nanoparticles

Questions about ProgramMaster? Contact programming@programmaster.org