|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Recent Advances in Functional Materials for Printed, Flexible and Wearable Electronics
||3D Electronics and Sensor Circuits by Combining Conventional PCB Technology with Low Temperature Embedding and Forming
||Bart Plovie, Frederick Bossuyt, Jan Vanfleteren
|On-Site Speaker (Planned)
In this contribution we present a technology for the fabrication of arbitrarily shaped 3D circuits. In a first phase a stretchable electronics circuit is produced on a flat temporary carrier. In a standard approach the technology is based on flexible PCB technology, where Cu conductors are designed as meanders to make them extensible, and where components are solder assembled. The circuit however can also be a thin-film or printed electronics circuit. In a second phase the circuit is embedded in a polymer. Embedding technologies used so far are lamination and injection molding, but also 3D printing can easily be used. If thermoplastic or non-cured thermoset materials are used for embedding, the whole structure can subsequently be heated to temperatures close to the Tg of the used polymers and the whole structure, including the embedded electronics, can be deformed, resulting in a 3D structure with arbitrary shape.
||Planned: Supplemental Proceedings volume