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Meeting 2018 TMS Annual Meeting & Exhibition
Symposium Recent Advances in Functional Materials for Printed, Flexible and Wearable Electronics
Presentation Title Delaminated Inkjet Printed Lines with Improved Electro-mechanical Behavior
Author(s) Megan Cordill
On-Site Speaker (Planned) Megan Cordill
Abstract Scope Inkjet printing is a state-of-the-art fabrication method for metal lines used in flexible and stretchable electronics. The technique is cost effective and relatively fast compared to standard thin film deposition methods and patterning, even with the necessary curing times. During curing the ink binders will burn away and leave an almost dense film composed of nanoparticles that is believed to be stress free. In some cases, delaminations can form during curing due to a compressive stress that evolved during curing. These delaminations would normally be considered as detrimental to the electrical and mechanical behavior. However, when these delaminated lines are characterized electro-mechanically, they were found to have higher crack onset strains and lifetimes. These improved properties will be demonstrated for printed Cu lines using various in-situ testing methods to illustrate that fabrication failures can be beneficial for flexible and stretchable applications.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

3-D Printed Polymer-based Gas Sensors
3D Electronics and Sensor Circuits by Combining Conventional PCB Technology with Low Temperature Embedding and Forming
3D Printed Anodes for Al-air Batteries
3D Printing of Metals and Metal Oxides from Solution for Energy and Biomedical Applications
3D Printing of Soft Ionic Actuators/Sensors for Soft Robotic Applications
Additive Manufacturing with Aerosol Jet: From Prototyping to Production
Challenges in Gravure and Direct-write Printing of Nano-colloidal Inks
Delaminated Inkjet Printed Lines with Improved Electro-mechanical Behavior
High Performance Sensors and Antennas by 2D and 3D Printing of Nanoparticles
Highly Stretchable Metallic Interconnects on Polymer Substrates: Architecture and Mechanisms
Hide details for [<a href="/PM/PM.nsf/ApprovedAbstracts/C0529C03377A93C285258193005AA23F?OpenDocument">Integrated and Flexible Integrated and Flexible Biosensors for Point-of-care Diagnostics
[Replication or Save Conflict]
Materials Integration for Flexible Electronics: Cu-interconnects, Supercapacitors
Microheater Array Powder Sintering: A New Process for Printed Electronics
Nondestructive Examination Study in P(VDF-TrFE) Filter System and PM2.5 Spatial Resolution Technology by Using Synchrotron Transmission X-ray Microscopy
Printable Functional Materials for Smart Fabrics
Recent Advancement on Printed, Stretchable, and Wearable Electronics in 2D Materials
Room-temperature Aerosol Deposition of PLZT Films on Polymer Substrates
Single-crystalline-like Semiconductor Films on Flexible Substrates: A Route towards Roll-to-roll Manufacturing of High-performance Electronic Devices
Stretchable Wirings Prepared with PU and Silver Flakes
Structural-resolved Study Of Piezoelectric Properties Of P(VDF-TrFE) Films
Textile-enabled Wearable Energy Storage Devices (invited)
Transparent Field Effect Biosensors Printed on Highly Curved Surfaces
Ultrafast Pulsed Light Sintering of Thermoelectric Nanoparticles

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