|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Effect of Ag, Ni and Bi Additions on Melting and Solderability of Lead-Free Solders
||Amir Hossein Nobari, Mehran Maalekian, Karl Seelig, Mihriban Pekguleryuz
|On-Site Speaker (Planned)
Among many lead-free alloys, the Sn-0.7Cu eutectic composition is an attractive candidate due to its relatively good solderability as well as low cost and environmental-friendliness. This alloy, however, has relatively high melting point. In this study, the effects of Ag, Ni and Bi additions on the melting and wetting behavior of the Sn-0.7Cu alloy are investigated. The melting behavior of solder alloys is assessed with Differential Scanning Calorimetry (DSC). Wetting behavior of solder alloys is studied by means of wetting balance test at different temperatures. It is shown that the addition of Ag reduces the melting temperature. A small amount of Ni reduces the undercooling with no effect on the melting point. The addition of Bi decreases the melting point and increases the pasty (mushy) range. Moreover, the wetting behavior of the alloys is compared and effect of alloying and melting temperature on wettability is discussed.
||Planned: A print-only volume