|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Effect of Orientation on the Bondability of the Sputtered Nano-twinned Copper
||Leh-Ping Chang, Fan-Yi Ouyang
|On-Site Speaker (Planned)
Cu-to-Cu direct bonding has been considered as a promising method to assembly chips in three-dimensional integrated circuit packaging technology. Nanotwinned Cu has been demonstrated to possess high mechanical strength and excellent electrical conductivity. In this study, the nano-twinned Cu thin film fabricated by unbalanced magnetron sputtering system was used to investigate the bonding quality through thermal compression bonding at 250℃ in vacuum environment. The bondability of nano-twinned Cu thin films with different orientations of (111) and (200) was studied and compared; we found that (111) Cu thin films exhibit best bondability and no significant voids were found at the bonding interfaces. The corresponding mechanism would be discussed.
||Planned: Supplemental Proceedings volume