|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Ultrafine-grained Materials X
||The Effect of Bismuth on Microstructure Evolution in Ultrafine-grained Copper
||Anna Kosinova, Boris B. Straumal, Askar R. Kilmametov, Eugen Rabkin
|On-Site Speaker (Planned)
We studied the effect of liquid Bi on the microstructure evolution of ultrafine-grained Cu produced employing the HPT method. The as-processed Cu exhibited inhomogeneous microstructure, with thin ultrafine-grained layers on the surface, and a bimodal microstructure in the bulk. The latter was a result of dynamic recrystallization during HPT. Surprisingly, bismuth had little effect on kinetics of recrystallization and grain growth in the bulk of as-processed Cu. Bi-rich intergranular films at the grain boundaries were observed in the samples annealed between 700 and 900 °C. Micrometer-thick intergranular liquid films penetrate into the bulk of the samples, preceded by the nanometric intergranular film of the Bi-rich phase (of 2-3 nm in thickness). We attributed the fact that Bi does not affect the kinetics of grain growth to the abundance of twin boundaries not affected by Bi segregation.
||Planned: Supplemental Proceedings volume