|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Mechanical Behavior at the Nanoscale III
||W-14: Localized Hardness and Modulus Distribution within SiC Grain of a Reaction Bonded SiC/Si Ceramic Matrix Composite
||Chun-yen Hsu, Fei Deng, Bo Yuan, Prashant Karandikar, Robert Opila, Chaoying Ni
|On-Site Speaker (Planned)
Reaction bonded SiC/Si (RBSC) ceramic matrix composites (CMCs) are promising candidates for applications in the field of high working temperature and semiconductor manufacture processes due to their outstanding hardness, modulus and chemical stability. Localized mechanical property distribution in SiC grain was investigated for 80 vol% α-SiC composite. The CMC was fabricated by liquid Si infiltration into a porous preform. Specimen was prepared using in-situ polishing with an Auriga 60 focused ion beam and scanning electron microscope (FIB/SEM) to minimize the relief at grain boundaries and reaction interfaces. Hexagonal α-SiC, reaction formed cubic SiC, and residual Si were detected. Selected SiC grains were tested using TriboIndentor and the 2-D hardness and modulus maps suggested a distribution of 32.4 to 43.6 GPa and 240.5 to 331.7 GPa respectively. The elastic modulus and hardness of α-SiC were improved where the cubic SiC formed epitaxially.
||Planned: A print-only volume