|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Estimation of Constitutive Parameters in beta-Sn by Instrumented Nanoindentation and Crystal Plasticity Simulation
||Aritra Chakraborty, Zhuowen Zhao, Philip Eisenlohr, Thomas Bieler
|On-Site Speaker (Planned)
Banning of lead in electronics in response to environmental and health concerns spurred a drive to substitute lead-based solders with tin-based interconnect materials. The body-centered tetragonal lattice structure of these novel solder materials, however, results in much higher anisotropy compared to the formerly used ones, which challenges our present capabilities to predict their in-service reliability. Each tin-based interconnect typically comprises of only one or a few crystallites. Therefore, a crystal plasticity description of their thermo-elasto-plastic behavior is required for more confident predictions. The adjustable parameters in the (phenomenological) constitutive description are optimized by comparing simulated and experimental topographies resulting from indenting a sphero-conical tip into individual grains of various lattice orientations. Financial support through NSF grant DMR-1411102 is gratefully acknowledged.
||Planned: A print-only volume