|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||High Temperature Lead-free Die Attach Materials - a Review
||HongWen Zhang, Ning-Cheng Lee, Jonathan Minter
|On-Site Speaker (Planned)
High-Pb solders have been used as die-attach materials for decades in discrete power packages. Due to the known harmful effects of Pb to human health/the environment and the demand of SiC power device serving under higher junction temperature, alternative Pb-free materials have been studied intensively. However, Pb-free alternatives are still in the infant age, and no well-recognized drop-in solution is available yet. The exemption of using high-Pb solders has been extended again to 2021, although it may be terminated anytime if a new technology/material were to be accepted industry-wide. This review is presenting the potential materials/technologies for high temperature lead-free die-attach, including solders, sintering materials, and solid-liquid interdiffusion material/technology. Although none of these materials/technologies are ideal to satisfy all the requirements of the variety of high temperature lead-free die attach applications in terms of processing/reliability/cost, each solution has the potential to satisfy a niche within this broader categorization.
||Planned: Supplemental Proceedings volume