About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Mechanical Response of Materials Investigated through Novel In-situ Experiments and Modeling
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Presentation Title |
Toughening Mechanism in Cu-Graphene Nanolayered Composite |
Author(s) |
Seung Min Han |
On-Site Speaker (Planned) |
Seung Min Han |
Abstract Scope |
The role of graphene interfaces in strengthening and toughening of the Cu-graphene nanocomposite was studied using in situ transmission electron microscopy (TEM) deformation and molecular dynamics (MD) simulations. In situ TEM tests revealed that the dislocation plasticity is strongly confined within single Cu grains by the graphene interfaces and grain boundaries. The weak Cu-graphene interfacial bonding induces stress decoupling, which results in independent plastic deformation of each Cu layer. MD simulations confirmed that the localized deformation made by such constrained dislocation plasticity results in the nucleation and growth of voids at the graphene interface, which acts as a precursor for crack nucleation. The graphene interfaces also effectively block crack propagation promoted by easy delamination of Cu layers dissipating the elastic strain energy. |
Proceedings Inclusion? |
Planned: |