|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Microstructural Evolution and Mechanical Performance of High-Bi, Sn-Bi Transient Liquid Phase Bonds
||John Holaday, Carol Handwerker
|On-Site Speaker (Planned)
Transient Liquid Phase Bonding (TLPB) technologies are being developed as alternative die attach, interconnect, and thermal interface materials not only to replace high-Pb solders but to provide improved performance and reliability. TLPB differs from other bonding methods involving liquid phases, such as liquid phase sintering or soldering, in that a low-melting temperature phase (LTP) melts and reacts completely with the high-melting temperature substrate (and sometimes with an added particulate phase) to form intermetallic compounds (IMC) with higher melting points than the original LTP. In our previous work, we identified composition and temperature ranges for Cu-Sn-Bi TLPB that avoids the pitfalls associated with a eutectic Sn-Bi LTP. Specifically, melting point of Cu-Sn-Bi TLP bonds were increased from 200°C to 271°C. In this presentation, we will address microstructural evolution including crystallographic orientation relationships during aging and relate these outcomes to mechanical performance for bonds assembled using a Bi-Sn LTP.
||Planned: Supplemental Proceedings volume