| About this Abstract |
| Meeting |
2016 TMS Annual Meeting & Exhibition
|
| Symposium
|
Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
|
| Presentation Title |
Effects of Bi on Microstructure Formation and Properties of Sn-Cu-Bi Based Solders |
| Author(s) |
Sergey A. Belyakov, Arif M.A.A. Salleh, Takatoshi Nishimura, Keith Sweatman, Kazuhiro Nogita, |
| On-Site Speaker (Planned) |
Sergey A. Belyakov |
| Abstract Scope |
There has been significant interest in the addition of Bi to increase thermal fatigue resistance of low- and no-Ag Pb-free solder joints while not compromising their resistance to drop impact. Here we study the influence of Bi on microstructure formation during reflow soldering and microstructure development during aging in Sn-Cu-Bi solders on Cu and ENIG substrates. The focus is on the formation of intermetallics, the nucleation and growth of tin and the resulting tin grain structure in BGA joints, and subsequent coarsening, growth and stability during ageing. The second part of the talk will focus on thermal cycling and shear impact properties with a focus on the influence of Bi on failure mechanisms. |
| Proceedings Inclusion? |
Planned: A print-only volume |