|About this Abstract
||2010 TMS Annual Meeting & Exhibition
||Processing Materials for Properties
||Enhanced Electrical and Mechanical Properties of the Heat-Treated Cu-Ni-(Si, Ti) Alloys
||Kwangjun Euh, Seung Zeon Han, Sangshik Kim, Sung Hwan Lim
|On-Site Speaker (Planned)
Cu-Ni-Si alloys are extensively used as leadframe and connector materials in the electronic devices due to their high strength. However, the electrical conductivity of Cu-Ni-Si alloy is relatively lower than those of other leadframe alloys such as Cu-Fe-P alloys. In order to increase electrical conductivity of Cu-Ni-Si alloy without deterioration of strength, thermomechanical treatment such as rolling and heat treatment can be one of promising candidate process methods. In this study, small amount of Ti was added to promote precipitation of Ni-Si compounds and heat-treated at the various temperature and time. Electrical and mechanical properties simultaneously increased at the early stage of aging. The microstructures and properties of the aged specimens were comparatively analyzed in order to understand the effect of aging process on the property enhancement of the Cu-Ni-(Si, Ti) Alloys.
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