|About this Abstract
||2010 TMS Annual Meeting & Exhibition
||Computational Thermodynamics and Kinetics
||Atomistic Behavior Driving High Temperature Contact Line Advancement
||Ying Sun, Edmund B. Webb
|On-Site Speaker (Planned)
Atomic scale phenomena driving contact line advancement during wetting of a solid by a liquid are investigated via molecular dynamics simulations of Ag(l) drops spreading on Ni substrates. For homologous temperature ~5% above melting for Ag, essentially non-reactive wetting is observed with relatively high spreading velocity. Delivery of material to the contact line occurs preferentially along the L/V interface. New material transported into the drop edge near the L/V interface displaces existing edge material. Atoms forming the droplet edge at a given instant are preferentially constrained near the S/L interface as the droplet advances across the substrate. While contact line advancement appears dominated by rapid flow along the L/V interface, evidence emerges that molecular kinetic mechanisms play a role as some atoms move with the contact line, desorbing and re-adsorbing between neighboring sites at the S/L interface. Results illustrate specific mechanisms underlying wetting and spreading behavior at high temperature.
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