| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Computational Thermodynamics and Kinetics
|
| Presentation Title |
Atomistic Behavior Driving High Temperature Contact Line Advancement |
| Author(s) |
Ying Sun, Edmund B. Webb |
| On-Site Speaker (Planned) |
Ying Sun |
| Abstract Scope |
Atomic scale phenomena driving contact line advancement during wetting of a solid by a liquid are investigated via molecular dynamics simulations of Ag(l) drops spreading on Ni substrates. For homologous temperature ~5% above melting for Ag, essentially non-reactive wetting is observed with relatively high spreading velocity. Delivery of material to the contact line occurs preferentially along the L/V interface. New material transported into the drop edge near the L/V interface displaces existing edge material. Atoms forming the droplet edge at a given instant are preferentially constrained near the S/L interface as the droplet advances across the substrate. While contact line advancement appears dominated by rapid flow along the L/V interface, evidence emerges that molecular kinetic mechanisms play a role as some atoms move with the contact line, desorbing and re-adsorbing between neighboring sites at the S/L interface. Results illustrate specific mechanisms underlying wetting and spreading behavior at high temperature. |
| Proceedings Inclusion? |
Definite: A CD-only volume |