| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Study on Paste Printing for Electronics |
| Author(s) |
Rafael Drumond Mancosu, Ocileide Custódio Silva, Renato Bonadiman |
| On-Site Speaker (Planned) |
Renato Bonadiman |
| Abstract Scope |
Paste printing is a cost efficient and well-controlled volume production method with current component selection to dose solder paste. However, the future trends in electronics will raise new demands for interconnection methods used in miniaturized assemblies. This work goals to overview the evolution of paste printing processes to attend the new demands of the market. In this sense, the new paste printing composition and manufacturing methods are also evaluated. According to this study paste printing when incremented with new compositions and methodologies can be considered an important technology to be applied in large industrial scale. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |