|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVI
||Ultra Thermal Stable Cu-to-Cu Interconnection
||Shih-kang Lin, Che-yu Yeh, Mei-jun Wang, Hao-miao Chang
|On-Site Speaker (Planned)
Cu-to-Cu interconnection is an essential process for a number of advanced applications in electronic industry, such as three-dimensional integrated circuit (3D IC) and wide band-gap (WBG) device. Conventionally Cu-to-Cu bonding involves micro-bumping by introducing solders. However, intermetallic compounds (IMCs) usually form at solder joints, which are brittle and electrical resistant. Moreover, as 3D IC joints are usually as small as 10 to 20 μm, soldering with conventional solders would result in full IMC joints with poor mechanical and electrical properties. In the presentation, a new Cu-to-Cu bonding concept is proposed. We fabricated fully ductile Cu-to-Cu joints with shear strength greater than 40 MPa and a tensile strength greater than 30 MPa. Furthermore, no strength decay was found after ageing at 300 ░C for 200 h. Instead, the strength gradually increased against ageing time. We demonstrate the high-reliability Cu-to-Cu joints, which is promising for next generation 3D IC and WBG applications.
||Planned: Supplemental Proceedings volume