|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Growth Behavior of Interfacial Intermetallic Compound at ENIG and Sn-Ag-Cu Solder Joint with Plating Temperature of Ni(P)
||Wonil Seo, Young-Ho Kim, Sehoon Yoo
|On-Site Speaker (Planned)
Interfacial intermetallic compound (IMC) growth behavior of ENIG/Sn-3.0Ag-0.5-Cu solder (SAC305) joint was investigated with varying temperature of Ni(P) electroless plating solution. The temperature of Ni(P) electroless plating solution for the ENIG finish was varied from 75 to 85C. SAC305 solder balls with diameters of 450 μm were mounted on the ENIG finish and reflowed at the peak temperature 250C. The brittle fracture behavior was evaluated with a high speed shear (HSS) test. After HSS test, fracture surface was observed to understand failure modes. A (Cu, Ni)6Sn5 IMC was formed at the interface between Ni(P) and SAC305. The grain size of the (Cu, Ni)6Sn5 IMC increased with increasing temperature of Ni(P) plating solution. The thickness of the IMC decreased with increasing the temperature of Ni(P) plating solution. In addition, the percentage of brittle fracture decreased with increasing the temperature of Ni(P) plating solution.
||Planned: Supplemental Proceedings volume