|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Mechanical Behavior of Nanostructured Materials
||Structure Dependent Creep Behavior of CuNb Nanolaminates
||Jaclyn Avallone, Thomas Nizolek, Irene Beyerlein, Nathan Mara, Tresa Pollock
|On-Site Speaker (Planned)
CuNb nanolaminates show extraordinary microstructural stability at high temperatures and stresses when compared to their single-phase components. Metallic multilayers with nanoscale layer thicknesses have higher strength and resistance to damage by shock and irradiation than those on the microscale. Unfortunately, at elevated temperatures, nanolaminates break down by layer pinch-off and coarsening more rapidly than microlaminates. Mechanical behavior of these multilayers is influenced by thermal evolution of the laminate structure, therefore, it is important to understand the relationship between annealing time and creep performance. Accumulatively roll bonded CuNb laminates spanning the micro- and nanoscales were subjected to load-jump creep tests to determine minimum creep rates at various stresses and annealing times. Finer layer thickness laminates with longer thermal exposure times are the most creep resistant. Characterization of the structural evolution and analysis of this novel creep behavior will be discussed with respect to initial and evolved structures.
||Planned: Supplemental Proceedings volume