|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Effect of Alloying Elements on Growth Kinetics of Intermetallics at Sn-Ag-Cu/Cu Interconnects
||Suresh Telu, Raghu Raj Rangaraju, Morgana Ribas, Siuli Sarkar
|On-Site Speaker (Planned)
Since the onset of Pb-free solders, Sb and Bi have been considered as alloying elements into systems such as Sn-Ag, Sn-Cu and Sn-Ag-Cu. Their ability forming a solid solution with Sn has been used for improving the reliability of solder joints. Recently, the electronics industry move toward miniaturization and higher operating temperatures (>0.4Tm) has been requiring solder alloys with higher reliability. Therefore, it became critical to investigate further the effect of these alloying additions on the solder joint. Here we study growth kinetics of intermetallic compounds formed at the interface with copper interconnects. Suitably prepared samples of Sn-3.8Ag-0.7Cu/Cu and Sn-0.3Ag-0.7Cu/Cu, with and without Sb and Bi additions were aged at temperatures ranging from 175-210°C. The resulting intermetallics thicknesses were used to calculate their growth rates and activation energies, and to propose a growth mechanism on the effect of Sb and Bi alloying additions in high- and low-Ag Sn-Ag-Cu solders.
||Planned: Supplemental Proceedings volume