|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVII
||Mechanical Properties of In-33.7Bi Alloy for Low Melting Temperature Solder
||Sanghun Jin, Min-Su Kim, Shutetsu Kanayama, Hiroshi Nishikawa
|On-Site Speaker (Planned)
Nowadays, flexible and wearable electronics with new functionalities have become emerging devices in the electronic industry. The flexibility and stretchability of materials allow various applications and designs which have been not previously possible with traditional electronics technology. Currently the peak temperature of reflow process exceeds over 250 ░C for Sn-Ag-Cu solders. In this temperature, the organic materials for flexible and wearable electronics are prone to receive thermal damage and may be deformed during heating. This may cause a problem of lowering the reliability of the electronic module. So we propose In-Bi alloys as a candidate for low-temperature Pb-free solders. In this study, the mechanical properties of In-33.7Bi alloy were evaluated by tensile testing and microstructure of the alloy was observed using scanning electron microscopy.
||Planned: Supplemental Proceedings volume