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Meeting Materials Science & Technology 2019
Symposium Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Presentation Title Interfacial Reactions in Co/Ag-Cu, Ni/Ag-Cu, Co/Ag-Sb and Ni/Ag-Sb Couples
Author(s) Sinn-wen Chen
On-Site Speaker (Planned) Sinn-wen Chen
Abstract Scope Thermoelectric and various kinds of modules require joining processes at higher temperatures. Both the Ag-Sb eutectic, Ag-41.0at.%Sb and Ag-Cu eutectic, Ag-39.9at.%Cu are good braze candidates. Co and Ni are frequently used as barrier layer materials. The interfacial reactions in the Co/Ag-Cu, Ni/Ag-Cu, Co/Ag-Sb and Ni/Ag-Sb are examined to provide fundamental understanding if Ag-Cu and Ag-Sb braze alloys are used. The related phase diagrams, Ag-Co-Ni, Ag-Co-Sb, Ag-Cu-Sb and Ag-Cu-Sb, are assessed and the interfacial reaction results are illustrated thereupon. No ternary compounds are observed in all the related ternary systems. Two phases, Ni5Sb2 and NiSb, are formed in the Ni/Ag-41.0at%Sb couples at 550℃. The Ni5Sb2 phase grows very fast. Two phases, CoSb and CoSb3, are formed in the Co/Ag-41.0at%Sb couples reacted at 550oC. The CoSb3 phase grows much faster than CoSb. No compound is formed in the Ni/Ag-39.9at%.Cu couples. The reaction layer is a layer of (Cu,Ni) solution of Ag solubility.
Proceedings Inclusion? Definite: At-meeting proceedings

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A Model Study of Microstructure Evolution and Bi Diffusion in Sn-Bi Low Temperature Soldering Systems
Corrosion Behavior of Electroplated and Electroless Plating Ni/Pd/Au Surface Finish on Automobile Printed Circuit Board
Effect of Reducing Agent on the Joint Strength of Sintered-joint with Cu Paste
Effect of Thermal Annealing on Structural Integrity of Cu-filled-through Si Via (TSV)
Heated Mechanical Cycling as a Substitute for Thermal Cycling - A Preliminary Investigation for a New Failure Analysis Technique
IMC Evolution as a Function of Grain Orientation under High Current Density in Sn-based Solder Joints
Instability Detection in Press-fit Connector Pin Interconnects after Thermo-mechanical Cycling
Interfacial Reactions in Co/Ag-Cu, Ni/Ag-Cu, Co/Ag-Sb and Ni/Ag-Sb Couples
Micro Interconnect Mechanical Stability in Cryogenic Temperature Environment
Micro Interconnect Shear and Creep Performance under Current Stressing
Microstructure Evolution in Cu and Ag Coated Cu Particle Sintering for Power Module Interconnection
Predicting Electromigration-mediated Damage in Interconnects Using Phase-Field Models
Stretchable Joint with Ag-PDMS for Wearable Electronics
Understanding Reliability Failure Mechanisms in Pb Free Solder Joint with Micro-gap Configuration

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