|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Recent Advances in Functional Materials for Printed, Flexible and Wearable Electronics
||Highly Stretchable Metallic Interconnects on Polymer Substrates: Architecture and Mechanisms
||Yeasir Arafat, Rahul Panat, Indranath Dutta
|On-Site Speaker (Planned)
Flexible electronics has important applications in defense, sportswear, and healthcare. In many applications, high stretchability of interconnects without significant deterioration is desirable. In this paper, we report on the fabrication of ductile In films on a PDMS (Polydimethylsiloxane) substrate stretched to at least 70% strain with minimal increase in electrical resistivity. The metal film is periodically bonded to substrate by closely spaced islands of Cr adhesion layer, which allows the film to stretch only above the space between the Cr-islands. We present evidence that the unusually high overall ductility of the metal film is due to localized strain at numerous narrow locations perpendicular to tensile direction, corresponding to the spacing of Cr-islands, where the onset of plastic instability is delayed. The role of the Cr-island spacing, and hence the effective gauge length of the sample, in instability-onset and post-necking elongation during micro-void growth and coalescence is also discussed.
||Planned: Supplemental Proceedings volume