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Meeting 2018 TMS Annual Meeting & Exhibition
Symposium Recent Advances in Functional Materials for Printed, Flexible and Wearable Electronics
Presentation Title K-16: Highly Stretchable Metallic Interconnects on Polymer Substrates: Architecture and Mechanisms
Author(s) Yeasir Arafat, Rahul Panat, Indranath Dutta
On-Site Speaker (Planned) Yeasir Arafat
Abstract Scope Flexible electronics has important applications in defense, sportswear, and healthcare. In many applications, high stretchability of interconnects without significant deterioration is desirable. In this paper, we report on the fabrication of ductile In films on a PDMS (Polydimethylsiloxane) substrate stretched to at least 70% strain with minimal increase in electrical resistivity. The metal film is periodically bonded to substrate by closely spaced islands of Cr adhesion layer, which allows the film to stretch only above the space between the Cr-islands. We present evidence that the unusually high overall ductility of the metal film is due to localized strain at numerous narrow locations perpendicular to tensile direction, corresponding to the spacing of Cr-islands, where the onset of plastic instability is delayed. The role of the Cr-island spacing, and hence the effective gauge length of the sample, in instability-onset and post-necking elongation during micro-void growth and coalescence is also discussed.
Proceedings Inclusion? Planned: Supplemental Proceedings volume


3-D Printed Polymer-based Gas Sensors
3D Printed Anodes for Al-air Batteries
3D Printing of Metals and Metal Oxides from Solution for Energy and Biomedical Applications
3D Printing of Soft Ionic Actuators/Sensors for Soft Robotic Applications
Additive Manufacturing with Aerosol Jet: From Prototyping to Production
Challenges in Gravure and Direct-write Printing of Nano-colloidal Inks
Delaminated Inkjet Printed Lines with Improved Electro-mechanical Behavior
High Performance Sensors and Antennas by 2D and 3D Printing of Nanoparticles
K-16: Highly Stretchable Metallic Interconnects on Polymer Substrates: Architecture and Mechanisms
Materials Integration for Flexible Electronics: Cu-interconnects, Supercapacitors
Microheater Array Powder Sintering: A New Process for Printed Electronics
Nondestructive Examination Study in P(VDF-TrFE) Filter System and PM2.5 Spatial Resolution Technology by Using Synchrotron Transmission X-ray Microscopy
Printable Functional Materials for Smart Fabrics
Recent Advancement on Printed, Stretchable, and Wearable Electronics in 2D Materials
Room-temperature Aerosol Deposition of PLZT Films on Polymer Substrates
Single-crystalline-like Semiconductor Films on Flexible Substrates: A Route towards Roll-to-roll Manufacturing of High-performance Electronic Devices
Stretchable Wirings Prepared with PU and Silver Flakes
Structural-resolved Study Of Piezoelectric Properties Of P(VDF-TrFE) Films
Textile-enabled Wearable Energy Storage Devices
Transparent Field Effect Biosensors Printed on Highly Curved Surfaces
Ultrafast Pulsed Light Sintering of Thermoelectric Nanoparticles

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