| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Shear and Bending Fatigue Failure of Lead Free Solder Joint and Fracture Mechanics |
| Author(s) |
Huili Xu, Woong Ho Bang, Choong-Un Kim, Tae-Kyu Lee, Hongtao Ma, Kuo-Chuan Liu |
| On-Site Speaker (Planned) |
Choong-Un Kim |
| Abstract Scope |
With continuing miniaturization of packaging structure for electronic devices, the reliability failure at solder joint is becoming of major concern in microelectronic industry. Among many mechanisms leading to solder joint failure, the fracture by cyclic bending, shear, and shock load is particularly concerned. Conventionally, those load conditions rarely contribute to the joint failure; however, with an expansion of mobile electronics combined with compact packaging structure, they are becoming equally problematic to more conventional cyclic thermal load. Consequently, there are growing numbers of research conducted on this subject in recent years, yet understanding on the involved fracture mechanics is still unclear. This paper presents the result of our investigation, both theoretical and experimental, that aim to identify the fracture mechanics active in cyclic bend and shear fatigue and the contributing factors to the fracture at each fatigue mode including type of solder alloy, mechanical constraints, and fatigue conditions. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |