|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Effects of Nanosized Ceramic Additions on Microstructure and Mechanical Properties of Sn3.0Ag0.5Cu Composite Solder
||Yuriy Plevachuk, Peter Švec Sr., Peter Švec, Dusan Janičkovič, Andriy Yakymovych, Herbert Ipser, Pavel Šebo
|On-Site Speaker (Planned)
Among the proposed lead-free interconnect materials, the ternary eutectic or near eutectic Sn–Ag–Cu is one of the most promising substitutes to replace the traditional Sn–Pb solders. Inert ceramic particles refine the IMC particles and grain size of the solder matrices which positively impact on the mechanical properties of solder alloys. The nano-composite solders were prepared by adding the ceramic TiO2, ZrO2, Al2O3 and SiO2 nanosized particles to the Sn3.0Ag0.5Cu (SAC305) solder paste. The melting characteristics of the composite solders were investigated using differential scanning calorimetry complemented by electrical resistivity measurements. The interfacial microstructures and mechanical properties of nano-composite solders reflowed between two Cu surface joints were investigated with respect to the type and amount of added nanoparticles. Scanning electron microscopy with EDS and X-ray diffraction were used to characterize the interfacial structure and morphology and to determine the chemical composition of the intermetallic compounds.
||Planned: A print-only volume