| About this Abstract |
| Meeting |
2022 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advances and Discoveries in Non-equilibrium Driven Nanomaterials and Thin Films
|
| Presentation Title |
Hybrid Thin Film Interface for High Temperature Electronics Modules |
| Author(s) |
Ajit Roy, Sergei Shenogin, John Ferguson, John Jones, Sabyasachi Ganguli |
| On-Site Speaker (Planned) |
Ajit Roy |
| Abstract Scope |
The widely known primary failure mode in electronics modules, observed upon thermal cycling, is due to the material thermal expansion (CTE) mismatch induced stress build-up (thermal and electron-phonon coupling) at the interfaces of the electronics chip (die) with a metalized substrate to bond with the heat spreader (heat sink). A hybrid materials design of thin film interface for minimizing the interface CTE mismatch, as a replacement of Directly Bonded Copper (DBC) will be presented. A molecular dynamics analysis of the design of Zr/Cu hybrid yielded almost 50 percent reduction of CTE as compared to that of Cu. A multi-source magnetron sputtering is employed for the deposition of ~200 nm Zr/Cu hybrid thin film as the interface material. The data on thermal cycling testing of the hybrid interface will be presented. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Nanotechnology, Modeling and Simulation, Thin Films and Interfaces |