|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Interface-driven Phenomena in Solids: Thermodynamics, Kinetics and Chemistry
||Grain Network Connectivity in 3D Copper Microstructures Resulting from Disparate Processing Routes
||J. Lind, S. F. Li, M. Kumar
|On-Site Speaker (Planned)
Properties of grain boundaries, such as energy, often depend on the relative crystallography of the interface. Grain boundary engineering seeks to promote the frequency of boundaries with more advantageous properties. Knowing only individual properties of grains and grain boundaries in a microstructure can be insufficient in estimating the constitutive material’s behavior/response, and conversely the arrangement of grain boundaries in the grain network can lead to emergent behavior/properties. Using 3D high energy X-ray diffraction microscopy, two 0.4mm^3 copper samples, one conventionally processed and the other grain boundary engineered, are measured through successive annealing treatments, and their grain boundary networks fully characterized. We will compare across samples the higher order crystallographic correlations in the grain boundary network and their energy distributions and show the connectivity and energetic composition of the two microstructures differs drastically depending on processing history. The subsequent thermodynamic evolution of their grain boundary network will be explored.
||Planned: A print-only volume