|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Effect of Strain Rate on Deformation Properties of Pb-free Solders
||Keith Sweatman, N Pavithiran, Wayne Ng, Tetsuya Akaiwa, Takatoshi Nishimura, Tetsuro Nishimura
|On-Site Speaker (Planned)
With the realisation that the strengthening effect of silver in tin-based lead-free solders fades as the alloy ages, formulators have looked to additions of elements that remain in solid solution in the tin matrix as an alternative or complementary strengthening mechanism. Because these two strengthening mechanisms work in different ways it can be expected that they respond to loading conditions in a different way. In the work reported in this paper, the strain rate sensitivity of a solid-solution-strengthened alloy, Sn-0.7Cu-0.05Ni-1.5Bi was compared that of that of the widely used Sn-0.7Cu-0.05Ni alloy and the particle-strengthened Sn-3.0Ag-0.5Cu in the as-cast and aged conditions. The strain rate sensitivity factor, m, which is a strong predictor of alloy performance, is calculated from the equation:σ=Cε ̇^m. Such information is needed for constitutive modelling for life prediction.
||Planned: Supplemental Proceedings volume