|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Edge Effect and Phase Formation in Cu-Sn-Ni Micro Joints during Solid-state Aging
||Haiyang Yu, C.R. Kao
|On-Site Speaker (Planned)
The three-dimensional integrated circuits technology is a useful way to continue miniaturization of electronics devices, and Cu-Sn-Cu and Cu-Sn-Ni is the most commonly used structures for chip bonding. Recently, many researchers have reported many results on Cu-Sn-Cu and Cu-Sn-Ni solid-liquid reactions, but there is few studies on solid-solid reactions. In this study, the Cu-Sn-Ni micro joints is prepared by electroplating. From the results, voids distribution, edge effect due to surface diffusion, and phase formation are analyzed and reported.
||Planned: Supplemental Proceedings volume