|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Edge Effect and Phase Formation in Cu−Sn−Ni Micro Joints during Solid−state Aging
||Haiyang Yu, C.R. Kao
|On-Site Speaker (Planned)
The three−dimensional integrated circuits technology is a useful way to continue miniaturization of electronics devices, and Cu−Sn−Cu and Cu−Sn−Ni is the most commonly used structures for chip bonding. Recently, many researchers have reported many results on Cu−Sn−Cu and Cu−Sn−Ni solid−liquid reactions, but there is few studies on solid−solid reactions. In this study, the Cu−Sn−Ni micro joints is prepared by electroplating. From the results, voids distribution, edge effect due to surface diffusion, and phase formation are analyzed and reported.
||Planned: Supplemental Proceedings volume