|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Wetting of Cu3Sn and Cu6Sn5 Compounds by Liquid Sn
||Oleksii Yu Liashenko, Fiqiri Hodaj
|On-Site Speaker (Planned)
In this work the wetting kinetics of Sn droplets spreading on Cu3Sn and Cu6Sn5 surfaces is studied. Experiments were performed in a metallic furnace under high vacuum (P=3x10-7 mbar) using transferred drop technique. Specific bulk Cu3Sn and Cu6Sn5 samples were prepared by melting suitable mixture of Cu and Sn while scalloped Cu6Sn5 samples were prepared by reaction between liquid Sn and Cu sheets. The wetting of Cu6Sn5 and Cu3Sn compounds was studied in the temperature range 250-380°C and 250-600°C respectively. Both CCD and high-speed camera are used for recording the spreading process. After the wetting experiments, cross sections of samples are characterized by SEM in order to determine the nature of the phases formed at the interfaces as well as to evaluate the extent of the dissolution process during spreading at different temperatures. Experimental results are analyzed in the framework of non-reactive and reactive wetting processes.
||Planned: Supplemental Proceedings volume